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217-36CTE6 - 

Heatsink; Press Fit; TO-220; 16C/W

Wakefield 217-36CTE6
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制造商產(chǎn)品編號(hào)：
217-36CTE6
倉庫庫存編號(hào)：
70236657
技術(shù)數(shù)據(jù)表：
View 217-36CTE6 Datasheet Datasheet
訂購熱線： 400-900-3095  0755-21000796, QQ:800152669, Email:sales@szcwdz.com
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217-36CTE6產(chǎn)品概述

Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers' component thermal specifications.

217-36CTE6產(chǎn)品信息

  Application  Board Level Power Semiconductors  
  Brand/Series  217 Series  
  Color  Metal  
  Convection, Forced  16°C/W @ 200 LFM  
  Convection, Natural  55°C @ 1 W  
  Dimensions  0.6 x 0.75 in.  
  Finish  Tin  
  For Use With  TO-263  
  Height, Above PC Board  0.39 in.  
  Material  Copper  
  Package Type  TO-220  
  Primary Type  D<sup>2</sup>PAK/TO-220/SOT-223/SOL-20  
  Resistance, Thermal  16 °C/W  
  Special Features  Surface Mount, No Interface Material is Needed, EIA Standards, ESD Protection  
  Thermal Resistance  16.0 °C/W  
  Type  Press-Fit  
關(guān)鍵詞         

217-36CTE6相關(guān)搜索

Application Board Level Power Semiconductors  Wakefield Application Board Level Power Semiconductors  Heatsinks Application Board Level Power Semiconductors  Wakefield Heatsinks Application Board Level Power Semiconductors   Brand/Series 217 Series  Wakefield Brand/Series 217 Series  Heatsinks Brand/Series 217 Series  Wakefield Heatsinks Brand/Series 217 Series   Color Metal  Wakefield Color Metal  Heatsinks Color Metal  Wakefield Heatsinks Color Metal   Convection, Forced 16°C/W @ 200 LFM  Wakefield Convection, Forced 16°C/W @ 200 LFM  Heatsinks Convection, Forced 16°C/W @ 200 LFM  Wakefield Heatsinks Convection, Forced 16°C/W @ 200 LFM   Convection, Natural 55°C @ 1 W  Wakefield Convection, Natural 55°C @ 1 W  Heatsinks Convection, Natural 55°C @ 1 W  Wakefield Heatsinks Convection, Natural 55°C @ 1 W   Dimensions 0.6 x 0.75 in.  Wakefield Dimensions 0.6 x 0.75 in.  Heatsinks Dimensions 0.6 x 0.75 in.  Wakefield Heatsinks Dimensions 0.6 x 0.75 in.   Finish Tin  Wakefield Finish Tin  Heatsinks Finish Tin  Wakefield Heatsinks Finish Tin   For Use With TO-263  Wakefield For Use With TO-263  Heatsinks For Use With TO-263  Wakefield Heatsinks For Use With TO-263   Height, Above PC Board 0.39 in.  Wakefield Height, Above PC Board 0.39 in.  Heatsinks Height, Above PC Board 0.39 in.  Wakefield Heatsinks Height, Above PC Board 0.39 in.   Material Copper  Wakefield Material Copper  Heatsinks Material Copper  Wakefield Heatsinks Material Copper   Package Type TO-220  Wakefield Package Type TO-220  Heatsinks Package Type TO-220  Wakefield Heatsinks Package Type TO-220   Primary Type D<sup>2</sup>PAK/TO-220/SOT-223/SOL-20  Wakefield Primary Type D<sup>2</sup>PAK/TO-220/SOT-223/SOL-20  Heatsinks Primary Type D<sup>2</sup>PAK/TO-220/SOT-223/SOL-20  Wakefield Heatsinks Primary Type D<sup>2</sup>PAK/TO-220/SOT-223/SOL-20   Resistance, Thermal 16 °C/W  Wakefield Resistance, Thermal 16 °C/W  Heatsinks Resistance, Thermal 16 °C/W  Wakefield Heatsinks Resistance, Thermal 16 °C/W   Special Features Surface Mount, No Interface Material is Needed, EIA Standards, ESD Protection  Wakefield Special Features Surface Mount, No Interface Material is Needed, EIA Standards, ESD Protection  Heatsinks Special Features Surface Mount, No Interface Material is Needed, EIA Standards, ESD Protection  Wakefield Heatsinks Special Features Surface Mount, No Interface Material is Needed, EIA Standards, ESD Protection   Thermal Resistance 16.0 °C/W  Wakefield Thermal Resistance 16.0 °C/W  Heatsinks Thermal Resistance 16.0 °C/W  Wakefield Heatsinks Thermal Resistance 16.0 °C/W   Type Press-Fit  Wakefield Type Press-Fit  Heatsinks Type Press-Fit  Wakefield Heatsinks Type Press-Fit  
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