904-27-1-23-2-B-0 -

Heatsink; Eliptical Pin with clip assembly; 27 x 22.6 mm

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制造商：: Wakefield Wakefield
制造商產(chǎn)品編號(hào)：: 904-27-1-23-2-B-0
倉(cāng)庫(kù)庫(kù)存編號(hào)：: 70357127
技術(shù)數(shù)據(jù)表：: Datasheet

訂購(gòu)熱線： 400-900-3095 0755-21000796, QQ:800152669, Email:sales@szcwdz.com

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904-27-1-23-2-B-0產(chǎn)品概述

Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.

904-27-1-23-2-B-0產(chǎn)品信息

904-27-1-23-2-B-0相關(guān)搜索

Brand/Series 904 Series Wakefield Brand/Series 904 Series Heatsinks Brand/Series 904 Series Wakefield Heatsinks Brand/Series 904 Series Dimensions 27 x 22.6 mm Wakefield Dimensions 27 x 22.6 mm Heatsinks Dimensions 27 x 22.6 mm Wakefield Heatsinks Dimensions 27 x 22.6 mm Finish Black Anodized Wakefield Finish Black Anodized Heatsinks Finish Black Anodized Wakefield Heatsinks Finish Black Anodized For Use With BGA Wakefield For Use With BGA Heatsinks For Use With BGA Wakefield Heatsinks For Use With BGA Material Aluminum Wakefield Material Aluminum Heatsinks Material Aluminum Wakefield Heatsinks Material Aluminum Thermal Resistance 3.5 °C/W Wakefield Thermal Resistance 3.5 °C/W Heatsinks Thermal Resistance 3.5 °C/W Wakefield Heatsinks Thermal Resistance 3.5 °C/W

郵箱：sales@szcwdz.com
Q Q：800152669
手機(jī)網(wǎng)站：m.szcwdz.com

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Brand/Series	904 Series
Dimensions	27 x 22.6 mm
Finish	Black Anodized
For Use With	BGA
Material	Aluminum
Thermal Resistance	3.5 °C/W
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